NDLI: Impact of packaging technology on system partitioning: a case study

Content Provider	IEEE Xplore Digital Library
Author	Dehkordi, P. Ramamurthi, K. Bouldin, D. Davidson, H. Sandborn, P.
Copyright Year	1995
Description	Author affiliation: Tennessee Univ., Knoxville, TN, USA (Dehkordi, P.; Ramamurthi, K.; Bouldin, D.)
Abstract	This paper emphasizes concurrent consideration of the partitioning of a microelectronic circuit design into multiple dies and the selection of the appropriate packaging technology for implementation of the entire system. Partitioning a large design into a multichip package is a non-trivial task. Similarly, selection of the MCM packaging technology to accommodate a multichip solution can also be puzzling. The interdependencies of these two problems afford the opportunity to achieve a global optimum when considered concurrently. In this paper we address the partitioning/MCM technology tradeoff, their interdependency and previous work in this area. The SUN MicroSparc CPU is used as a demonstration vehicle and is partitioned for different MCM technologies. The preliminary results show that the optimum number of partitions and contents of each partition depend heavily on the choice of MCM technologies for a given application.
Starting Page	144
Ending Page	149
File Size	486369
Page Count	6
File Format	PDF
ISBN	0818669705
DOI	10.1109/MCMC.1995.512018
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-01-31
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Computer aided software engineering System performance Bonding Sun Integrated circuit packaging Costs Microelectronics Circuit synthesis Appropriate technology Vehicles
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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