NDLI: All Digital-RF SATCOM Transceiver Provides the Modular Open Systems Architecture Required to Meet HC3 GRA

Content Provider	IEEE Xplore Digital Library
Author	Mukhanov, Oleg Hitt, Dick Littlefield, Wes Rittenbach, Thomas
Copyright Year	2007
Description	Author affiliation: Hypres, Inc., Elmsford, NY (Mukhanov, Oleg; Hitt, Dick; Littlefield, Wes) \|\| US Army RDECOM CERDEC STCD, Fort Monmouth, NJ (Rittenbach, Thomas)
Abstract	Government software standards such as the Software Communications Architecture (SCA) have been proposed and are evolving to facilitate reuse and portability of both software waveforms and hardware. To date these steps have shown limited success in maximizing reuse and reducing costs for new applications. As a result, PM WINT HC3 has been defining a new modular Open Systems Architecture (OSA) that is designed to address these issues using a Government Reference Architecture (GRA) that provides for both hardware and software modularity and portability. An All Digital-RF transceiver design provides programmability and flexibility into a multiple band architecture that can be incorporated into modules that easily meet the HC3 GRA modular OSA requirement while providing many unique benefits. A system concept is presented which employs cryo-genically cooled superconductor microelectronic (SME) technology to enable a next-generation multiple band, multiple channel MILSATCOM system with the goal of achieving HC3 GRA modular OSA compliance simultaneously at frequencies covering the C, X, Ku, Ka and EHF bands. All Digital-RF technology brings revolutionary changes in the design and implementation of RF microwave electronics. For the first time, it becomes practical to implement high frequency RF functions in the digital domain - all accomplished with extreme low-noise performance and spectral purities with ultra-fast speeds otherwise unattainable with competing semiconductor technologies, analog or digital. These new Digital-RF "tools" lead directly to modular system designs that support multi-band and multi-channel operation from a single RF platform with much smaller antennas, increased capacities and flexibility.
Starting Page	1
Ending Page	6
File Size	6929056
Page Count	6
File Format	PDF
ISBN	9781424415120
DOI	10.1109/MILCOM.2007.4455199
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2007-10-29
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Transceivers Open systems Computer architecture Radio frequency Government Hardware Software standards Costs Application software Superconducting microwave devices
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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