NDLI: Study on light sensitive functional failures in VLSI failure analysis

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2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Development and application of prognostics and health management technology

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Optical Probing of FinFETs

Thickness measurement of Si substrate with infrared laser of Optical Beam Induced Resistor Change (OBIRCH) in failure analysis

A non destructive scan diagnosis based fault isolation technique verification method using infrared laser stimulation on wafer level

Bias-temperature instability of Si and Si(Ge)-channel sub-1nm EOT p-MOS devices: Challenges and solutions

Understanding correlated drain and gate current fluctuations

Impact of cerium oxide's grain size for dielectric relaxation

Investigation of chromium contamination induced TDDB degradation in MOSFET

Failure analysis considerations in designing for EOS/ESD robustness

A high latchup - Immune ESD protection SCR-incorporated BJT in deep submicron technology

A study of latch-up mechanisms for adjacent pins on multiple power supply circuits

Application of photoemission microscopy (PEM) and Computer Aided Design (CAD) navigation system in localization of high side power switch open contact failure

Failure analysis of complicated case by functional OBIRCH method

Design flow and techniques for fault-tolerant ASIC

Optimization of TEM sample preparation methods by FIB for the increase of throughput

Application of PVC to significantly improve the success rate in locating trench defect using FIB after electrical failure localization

Investigation of Time Domain Reflectometry (TDR) on Power Mosfet semiconductor device

Fast 3D tomography at package level by using Xe plasma focused ion beam

Optical probing (EOFM / TRI): A large set of complementary applications for ultimate VLSI

Advanced transient thermoreflectance 2D imaging for integrated circuit sub-micron defect detection and thermal analysis

Innovative way of implementing active voltage contrast

New statistical post processing approach for precise fault and defect localization in TRI database acquired on complex VLSI

New technique of sample preparation for 3DIC micro_bumps observation

Interconnect reliability assurance for circuits with billions of transistors

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Failure analysis on non-visible front-end defects in deep NWELL implantation related process

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Study on light sensitive functional failures in VLSI failure analysis

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Investigation of failures on dual-dies stacked package

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Reliability characterization exploring extreme conditions for chips' design optimization

The application of fault tree analysis method in electrical component

The real-time fault diagnosis of electrolytic filter capacitors in switching mode power supply

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Radiation response analyzer of semiconductor dies

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Channel thermal noise modeling and high frequency noise parameters of tri-gate FinFETs

Characteristic analysis of total dose irradiation annealing effect in SOI NMOSFET

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The evaluation of quality and reliability management system in the foundry process

Failure analysis for via with solder bubble

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005.

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743)

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)

Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)

Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394)

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Study on light sensitive functional failures in VLSI failure analysis

Content Provider	IEEE Xplore Digital Library
Author	Gaojie Wen Diwei Fan Li Tian Chunlei Wu Miao Wu Wang, W.
Copyright Year	2013
Description	Author affiliation: Freescale Semicond. (China) Ltd., Tianjin, China (Gaojie Wen; Diwei Fan; Li Tian; Chunlei Wu; Miao Wu; Wang, W.)
Abstract	Functional failures which were sensitive to temperature or voltage were usually seen in failure analysis and many strategies have been employed to solve this kind of failure. But some special failed ICs which were sensitive to light post decapsulation were difficult to handle. Three light sensitive functional failure cases were presented in this paper to show how we can find the root cause efficiently and what kind of mechanism lead to them sensitive to light.
Starting Page	186
Ending Page	189
File Size	4134300
Page Count	4
File Format	PDF
ISBN	9781479912414
ISSN	19461550
e-ISBN	9781479904808
DOI	10.1109/IPFA.2013.6599151
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-07-15
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Metals Failure analysis Integrated optics Optical sensors Layout Optical imaging Integrated circuits
Content Type	Text
Resource Type	Article

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