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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Junwen Liu Qing-an Huang Jing Song Jieying Tang |
| Copyright Year | 2009 |
| Description | Author affiliation: Key Laboratory of MEMS of Education Ministry, Southeast University, Nanjing, 210096, China (Junwen Liu; Qing-an Huang; Jing Song; Jieying Tang) |
| Abstract | Hermetic packaging is introduced as a main mode for the MEMS (micro-electromechanical-system) device packaging. The reliability of micro-structures in hermetic packaging has become the most important part for the successful commercialization. With the decrease in the dimension and material processing, the ubiquitous surface effect between device and substrate has become more and more effective. Surface-micromachined structures formed by the wet etching of sacrificial layers are commonly plagued by problems of sticking to the substrate. The failure of devices according to the stiction has become a main factor of the MEMS reliability. In this paper, an experimental way is presented to analyze two important force of surface effect: capillary force and van der Waals force. The cantilever beam is used as a classic MEMS device, and the structure of beam is specially designed for the experiment. It can greatly reduce the capillary force in a vacuum environment, so the two forces are separated through two different environmental experiments. This paper simulates different packaging environments to separate capillary force from stiction force, and analyzes the composition of the stiction force. The experimental results and theoretical summary could provide a useful reference for the design and predict the stiction failure of micro-structures. |
| Starting Page | 331 |
| Ending Page | 335 |
| File Size | 6869423 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424439119 |
| ISSN | 19461542 |
| DOI | 10.1109/IPFA.2009.5232640 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2009-07-06 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Packaging Micromechanical devices Rough surfaces Surface roughness Structural beams Microelectromechanical devices Commercialization Wet etching Electrostatics Equations |
| Content Type | Text |
| Resource Type | Article |
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