NDLI: Elimination of opens failure between via holes and traces in LTCC multilayer substrate by coherent shrinkage

Content Provider	IEEE Xplore Digital Library
Author	He, X.Q. Ma, X. Zhang, Y.
Copyright Year	2001
Description	Author affiliation: Nat. Key Lab. of Reliability Phys. of Electron. Product, CEPREI, Guangzhou, China (He, X.Q.)
Abstract	MCM-C technology is based on the use of a multilayer ceramic substrate as the carrier for the various chip devices. Low temperature co-fired ceramic (LTCC), with the advantage of higher wiring density and lower dielectric constant, is widely used as the multilayer substrate for high density electronic packaging, such as MCM-C. The low firing temperature enables the use of precious metals in the conducting layers. With the development of MCM technology, the LTCC substrate is larger and has many more layers to satisfy the increasing assembly performance requirements. However, with the enlargement of substrate area, the firing shrinkage mismatch between the metal conductor and the ceramic matrix leads to the more serious problem of open failures (Imanaka et al., 1992; Miura et al., 1994; Itagaki et al., 1993). In this work, the open failure between via holes and traces in LTCC substrates was studied. The effect of compacting temperature, ceramic particle size, softening point, stack process and firing profile was reported. Finally, by means of coherent shrinkage, the open failure between via holes and traces in LTCC was eliminated effectively.
Sponsorship	IEEE Electron Device Soc
Starting Page	138
Ending Page	141
File Size	532611
Page Count	4
File Format	PDF
ISBN	0780366751
DOI	10.1109/IPFA.2001.941472
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-07-13
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Ceramics Dielectric substrates Temperature Firing Nonhomogeneous media Wiring Dielectric constant Electronics packaging Assembly Conductors
Content Type	Text
Resource Type	Article

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