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Content Provider | IEEE Xplore Digital Library |
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Copyright Year | 1996 |
Abstract | The Omega3/LHC1 pixel detector readout chip is aimed at future LHC vertex detector applications. It is the latest member of the Omega series designed at CERN. It comprises an array of 128/spl times/16 pixel readout cells of 50 /spl mu/m/spl times/500 /spl mu/m and the chip contains more than 800,000 transistors. In the design particular emphasis is given to cell-to-cell and chip-to-chip uniformity, and testability, proven key parameters in existing pixel systems. Each cell contains a full readout chain with preamp, discriminator with adjustable threshold and fast-OR output, a globally adjustable delay with local fine-tuning, coincidence logic and memory. Each cell can be individually addressed for electrical test and masking. Several operation modes allow full testing and data acquisition with different ways to resolve timing ambiguities. The layout of one cell and the corresponding chip photograph are shown below. We present results obtained from electrical tests of a chip without detector as well as from radioactive source measurements using a chip which has been bump-bonded to a 300 /spl mu/m thick Si detector. A timewalk of <10 ns and a delay precision of <6 ns rms have been measured. The noise is /spl sim/100 e/sup -/ rms. The lowest threshold setting is close to 3000 e/sup -/ and the non-uniformity has been measured to be /spl sim/450 e/sup -/ rms at a threshold of 5 000 e/sup -/. Source measurements showed good uniformity of response to both /spl beta/ and /spl gamma/ rays. |
File Size | 129920 |
File Format | |
ISBN | 078033180X |
DOI | 10.1109/NSSMIC.1995.504257 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 1995-10-21 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Delay Detectors Semiconductor device measurement Large Hadron Collider System testing Logic Data acquisition Timing Electric variables measurement Thickness measurement |
Content Type | Text |
Resource Type | Article |
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