NDLI: An ink-jet head using diaphragm microactuator

Content Provider	IEEE Xplore Digital Library
Author	Hirata, S. Ishii, Y. Matoba, H. Inui, T.
Copyright Year	1996
Description	Author affiliation: Precision Technol. Dev. Center, Sharp Corp., Nara, Japan (Hirata, S.; Ishii, Y.; Matoba, H.; Inui, T.)
Abstract	An ink-jet head using a buckling diaphragm microactuator is described. The microactuator is composed of a silicon substrate, silicon dioxide insulator, nickel heater and electro-plated nickel diaphragm. All the edges of the diaphragm are fixed on the substrate and a narrow gap is formed between the diaphragm and the substrate. A nozzle plate is connected to the actuator by an adhesive spacer to get the ink-jet head. An ink chamber is formed by the surfaces of the diaphragm, the nozzle plate, and the side wall of the spacer. When the diaphragm is heated, thermally induced compressive stress causes the diaphragm to buckle rapidly and the diaphragm simultaneously deflects toward the nozzle plate. The deflection raises the pressure in the ink chamber and an ink droplet is then ejected through the nozzle. The ink-jet head has been designed to maximize the droplet velocity, minimize the thermal response of the actuator and optimize the energy consumption needed to eject an ink droplet. The head design was carried out by using mechanical analysis of a buckling model, and heat transfer simulation. The diaphragm made from nickel is 300 /spl mu/m diameter and 2 /spl mu/m-thick. The microactuator has been built using a combination of surface- and bulk-micromachining. An ink droplet has been ejected with a velocity of 8 m/s while the ink-jet head is operated by heating the diaphragm with a current of 510 mA at 16.6 V for 10 /spl mu/s at 1.8 kHz. We assured that no bubble was generated at less than 1.8 kHz. The fabrication process used to make the microactuator is briefly reported.
Starting Page	418
Ending Page	423
File Size	760985
Page Count	6
File Format	PDF
ISBN	0780329856
DOI	10.1109/MEMSYS.1996.494018
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1996-02-11
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microactuators Ink Nickel Actuators Silicon compounds Insulation Thermal stresses Compressive stress Design optimization Energy consumption
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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