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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Hasegawa, H. Kasai, S. |
| Copyright Year | 2005 |
| Description | Author affiliation: Res. Center for Integrated Quantum Electron., Hokkaido Univ., Sapporo, Japan (Hasegawa, H.; Kasai, S.) |
| Abstract | Presents and discusses a new smart chip called an "intelligent quantum (IQ) chip". III-V semiconductor chips with sizes of millimeter square and memories are integrated on chip with capabilities of wireless communication, wireless power supply and various sensing functions. It is an attempt to endow "more intelligence" than simple identification (ID) like in RFID chips to semiconductor chips. A key issue to realize IQ chips is the power consumption of processor/memory parts which increases as one tries to endow more intelligence. The power density of the current Si CMOS technology is too high. Thus, use of quantum devices should lead to large reduction of power density. |
| File Size | 63762 |
| File Format | |
| ISBN | 0769523986 |
| DOI | 10.1109/ICMENS.2005.57 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2005-07-24 |
| Publisher Place | Canada |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | III-V semiconductor materials Nanotechnology CMOS technology Wireless sensor networks Radiofrequency identification Intelligent sensors Circuits Micromechanical devices Biological materials Organic materials |
| Content Type | Text |
| Resource Type | Article |
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