NDLI: Friendly tools for the thermal simulation of power packages

Content Provider	IEEE Xplore Digital Library
Author	Rencz, M. Szekely, V. Poppe, A. Courtois, B.
Copyright Year	2000
Description	Author affiliation: Micred Ltd., Hungary (Rencz, M.)
Abstract	Thermal simulation is a frequently needed task in the design of integrated power packaging. Thermal simulation is used in the design of new devices, in the design of the placement of the dissipating elements on the chip and for the design of the packages. Thermal simulators can help to find the best mounting solutions for the devices if they have to operate in thermally strained conditions. Thermal simulation is usually done using finite element method (FEM) based simulator programs. These are general-purpose expensive simulators, where the general usability comes together with complicated, and usually difficult to learn and difficult to use user interfaces, and these programs are relatively slow and inaccurate. To overcome these problems, we have developed two fast and easy to use 2D and 3D thermal simulator programs, SUNRED (Szekely and Rencz, 1998) and THERMAN (Csendes et al, 1998; Szekely et al, 1999). In the recent development, the first goal was to create user friendly tools which design engineers are happy to use in thermal design tasks, since the tools are fast enough to provide answers to their thermal questions almost immediately. As a result of this feature, the designers can study the effects on the thermal behavior of all modifications in the geometry of their structure or in the boundary conditions immediately on their computer screen.
Starting Page	51
Ending Page	54
File Size	559000
Page Count	4
File Format	PDF
ISBN	0780364376
DOI	10.1109/IWIPP.2000.885181
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-07-14
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Computational modeling Thermal engineering Geometry Transmission line matrix methods Material properties Temperature Capacitance Laboratories Finite element methods
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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