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  1. IEEE International Workshop on Integrated Power Packaging.
  2. IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)
  3. Power supply arcing
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IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)
IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)
Present practice of power packaging for DC/DC converters
An advanced approach to power module packaging
An integrated architectural framework for power conversion systems
Performance of silicon carbide devices in power converters
A report on packaging implications of advances in capacitor technologies
Power supply arcing
Polymer thick film (PTF) and flex technologies for low cost power electronics packaging
Embedded power-a multilayer integration technology for packaging of IPEMs and PEBBs
Study of power module package structures
Friendly tools for the thermal simulation of power packages
RF de-embedding technique for extracting power MOSFET package parasitics
Electromagnetic compatibility: bench testing for power assemblies
MCM-D package for power applications
A comparative study of wire bonding versus solder bumping of power semiconductor devices
High power IGBT modules: thermal fatigue resistance evaluation of the solder joints
Low stress anhydride molding compound for RF applications
Characterization of solderable metallization on power devices for 3-D packaging
Package effects on avalanche rating of power MOSFETs
Electromagnetic limits of planar integrated resonant/transformer structures for power electronic applications
Fabrication of thin-film V-groove inductors using composite magnetic materials
IWIPP Proceedings. IEEE International Workshop on Integrated Power Packaging (Cat. No.98EX203)

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Power supply arcing

Content Provider IEEE Xplore Digital Library
Author Singh, P. Mazzuca, S. Yao, Y. Galyon, G. Ronken, V. Hedlund, L. Kinnard, J.
Copyright Year 2000
Description Author affiliation: Server Div., IBM Corp., Poughkeepsie, NY, USA (Singh, P.)
Abstract The trend to pack more power in smaller spaces is leading to higher rates of computer power supply arcing in the field. Power density increase is being achieved by decreasing the spacing between features such as the power train MOSFET leads and by increasing the switching frequency. Both of these changes make power supplies more prone to field arcing. This paper discloses a technique called the partial vacuum test to predict the arcing propensity in power supplies. The partial vacuum test also helps determine the corrective actions needed to avoid field arcing by indicating the locations susceptible to arcing. The paper also describes a test called the zinc spray test that can help determine the minimum spacing between features, subjected to high voltages with high frequency harmonics, that will not arc in the field.
Starting Page 29
Ending Page 32
File Size 438540
Page Count 4
File Format PDF
ISBN 0780364376
DOI 10.1109/IWIPP.2000.885177
Language English
Publisher Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date 2000-07-14
Publisher Place USA
Access Restriction Subscribed
Rights Holder Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword Power supplies Testing Vacuum arcs MOSFET circuits Power MOSFET Switching frequency Vacuum technology Zinc Spraying Voltage
Content Type Text
Resource Type Article
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