NDLI: REP EcoDesign Tomorrow

Content Provider	IEEE Xplore Digital Library
Author	Hayashi, H.
Copyright Year	2001
Description	Author affiliation: Fujikura Ltd., Tokyo, Japan (Hayashi, H.)
Abstract	REP (Japan Institute of Electronic Packaging) is the largest organization in Japan to investigate and exchange knowledge on Electronic Interconnection and Packaging Issues. The organization first co-organized Environmentally Conscious Engineering in Electronics '96 cooperating with LCA forum of Japan and University of Tokyo / Inverse Manufacturing Laboratory in 1996 and has since been playing major roll in Environmentally Conscious Engineering Issue in Electronic Packaging Industry. The emerging growth of IT(Information. Technology) Industry is expecting huge demand on resource and waste disposal. Elimination of toxic substances, such as VOC, lead in solder, halide in substrate, from waste is still very important subject for JIEP Environmentally Conscious Engineering. However, it should not be the only subject. As no Electronic Equipment is realized without Electronic Packaging Technology ("Jisso" or "Jisso technology" is more commonly used in the industry as it has more integral meaning) the issue of Energy saving, Material saving are also the subjects of Jisso design. Recycling is also a very important subject of material saving and the subject of ecology as well. All these subjects are those of REP EcoDesign Tomorrow. Performance, cost and environmentally conscious thinking are three factors to form axis of Engineering thinking.
Starting Page	1018
Ending Page	1019
File Size	83685
Page Count	2
File Format	PDF
ISBN	0769512666
DOI	10.1109/ECODIM.2001.992512
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-12-11
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Electronics industry Manufacturing industries Power engineering and energy Industrial electronics Waste disposal Lead Electronic equipment Recycling Environmental factors
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

E-scrap exportation: challenges and considerations

Challenges in determining electronics equipment take-back levels

The impact of lead-free legislation exemptions on the electronics industry

Stencil Design for Lead-Free Reflow Process

Electronics recycling-another dimension

Ecodesign technical committee of JIEP (Japan Institute of Electronics Packaging) and its activity

Market considerations in the reuse of electronic products

Examining the environmental impact of lead-free soldering alternatives

An investigation of bulk recycling planning for an electronics recycling facility receiving industrial returns versus residential returns [Abstracts of Forthcoming Manuscripts]

REP EcoDesign Tomorrow

Similar Documents

E-scrap exportation: challenges and considerations

Challenges in determining electronics equipment take-back levels

The impact of lead-free legislation exemptions on the electronics industry

Stencil Design for Lead-Free Reflow Process

Electronics recycling-another dimension

Ecodesign technical committee of JIEP (Japan Institute of Electronics Packaging) and its activity

Market considerations in the reuse of electronic products

Examining the environmental impact of lead-free soldering alternatives

An investigation of bulk recycling planning for an electronics recycling facility receiving industrial returns versus residential returns [Abstracts of Forthcoming Manuscripts]

REP EcoDesign Tomorrow