NDLI: Investigating the Influence of Interconnection Parasitic Inductance on the Performance of SiC Based DC-DC Converters in Hybrid Vehicles

Content Provider	IEEE Xplore Digital Library
Author	Di Han Woongkul Lee Noppakunkajorn, J. Sarlioglu, B.
Copyright Year	2014
Description	Author affiliation: Wisconsin Electr. Machines & Power Electron. Consortium (WEMPEC), Univ. of Wisconsin-Madison, Madison, WI, USA (Di Han; Woongkul Lee; Noppakunkajorn, J.; Sarlioglu, B.)
Abstract	Silicon carbide (SiC) based devices are known to outperform Si devices in many aspects, such as lower power dissipation, higher operating temperatures, and higher switching frequencies. SiC devices will benefit hybrid vehicles when applied into the DC-DC converters and inverters as part of the electrical power conversion needed to drive the powertrain. Nevertheless, SiC devices can suffer from oscillations as a result of the underdamped response to an RLC circuit composed of device output capacitance, parasitic inductance, and on-state resistance. This paper aims at investigating the influence of the interconnection parasitic inductance on the performance of SiC-based DC-DC converter in hybrid vehicles.
Sponsorship	IEEE Ind. Appl. Soc.
Starting Page	1
Ending Page	7
File Size	266783
Page Count	7
File Format	PDF
ISBN	9781479922628
DOI	10.1109/ITEC.2014.6861850
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2014-06-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Performance evaluation MOSFET Integrated circuit interconnections Semiconductor loss Parasitic inductance Hybrid electric vehicles Vehicles Inductance DC-DC converters Silicon carbide Efficiency Logic gates Silicon carbide power devices
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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Analysis of High-Speed PCB With SiC Devices by Investigating Turn-Off Overvoltage and Interconnection Inductance Influence

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