NDLI: Single-Chip Integrated 3-D Hall Sensor

Content Provider	IEEE Xplore Digital Library
Author	Hongbing Pan Leyu Yao Shuzhuan He Wei Li Li Li Jing Sha
Copyright Year	2013
Description	Author affiliation: Sch. of Electron. Sci. & Eng., Nanjing Univ., Nanjing, China (Hongbing Pan; Shuzhuan He; Wei Li; Li Li; Jing Sha) \|\| Nanjing Foreign Language Sch., Nanjing, China (Leyu Yao)
Abstract	A single-chip three-dimensional(3-D)Hall sensor for high-accuracy three-axis magnetic-field measurements is presented. The chip contains a 3-D Hall device, the analog signal conditioning circuit, an A/D converter and the digital signal-processing unit. The 3-D Hall device contains horizontal and vertical Hall elements. The horizontal Hall element measures the perpendicular component, and four vertical Hall elements measure the two in-plane components of a magnetic flux. With the detailed analysis of the essential factors affecting Hall voltage, the signal conditioning circuit based on spinning current technique is provided, which works in 100kHz and can cancel the offset, reduce the 1/f noise and amplify the signal. The digital signal-processing unit provides the high-accuracy mapping algorithm between measured values and target values.
Sponsorship	IEEE Comput. Soc.
Starting Page	252
Ending Page	255
File Size	182560
Page Count	4
File Format	PDF
ISBN	9780769551227
DOI	10.1109/IMCCC.2013.60
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2013-09-21
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Semiconductor device measurement Magnetic flux density Magnetic field measurement Magnetic sensor Magnetic sensors CMOS sensor CMOS technology CMOS integrated circuits 3-D Hall sensor
Content Type	Text
Resource Type	Article

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