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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Huihua Liu Lo, J.C.C. Lee, S.W.R. |
| Copyright Year | 2013 |
| Description | Author affiliation: Center for Adv. Microsyst. Packaging, Hong Kong Univ. of Sci. & Technol., Kowloon, China (Huihua Liu; Lo, J.C.C.; Lee, S.W.R.) |
| Abstract | As the emergence of solid state lighting, light emitting diodes (LEDs) have been developed for applications of tremendous usage. For indoor lighting, LED light bulbs share large portions of market. The chip on board (CoB) package is a very attractive architecture for high brightness LEDs which can lead improved price competiveness, package integration and thermal performance. Waffle pack LED packaging technology has been proposed based on wafer level packaging (WLP) technology and remote phosphor configuration. The package has a huge potential for mass production and cost reduction. However, so far there were few optical results reported. In current study, photometry tests of both the component and light bulb were made. Optical indices such as luminous flux, CCTs and near field / planar light distributions were measured. The package was compared with the commercial CoB module. A ray tracing tool was used for helping experimental validation. The results showed that the waffle pack produces white light with improved angular color uniformity. The two components have similar lighting distributions, and waffle pack produces higher optical output than traditional CoB package. |
| Starting Page | 142 |
| Ending Page | 146 |
| File Size | 1029104 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781479922499 |
| e-ISBN | 9781479922505 |
| DOI | 10.1109/SSLCHINA.2013.7177334 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-11-10 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Integrated optics Semiconductor device measurement Stimulated emission Optical variables measurement Lead Optical variables control Reliability |
| Content Type | Text |
| Resource Type | Article |
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