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2013 10th China International Forum on Solid State Lighting (ChinaSSL)

Table of contents

A novel process obtaining silicone dome lens for wafer level LED packaging

Thermal behavior of flip chip LED packages using electrical conductive adhesive and soldering methods

A fully-integrated compact LED module with inductor-less and capacitor-less LED driver

A new coating configuration with two phosphor layers laminated for white PC-LEDs

A new MOCVD platform, prismo D-Blue™, for high-throughput GaN LED production

Self-adaptive remote phosphor coating for pc-LEDs packaging by self-exposure slurry method

A study on the feasibility of LED in the wound healing application

Study of defect density and aging properties of GaN LEDs

An improved electrophoretic deposition method for wafer level white pc-LED array packaging

Analysis of LED lighting product certification & suggestion on photobiological safety

Application of switched capacitor converters in Solid State Lighting

Automatically controlling illuminating light color in the presence of ambient light

Cause analysis on highly depreciated indoor LED product in CSA020

Development of high quality and low defect density semipolar and non-polar GaN templates

Building dynamic models of LED lamps by system identification methods

Evaluation on the non-visual biological effects of light sources

An accelerated lifetime test method for DC or AC supplied electronic control gear for LED modules of outdoor LED lighting products

Freeform LED lens design for uniform rectangular illumination using a new source-target mapping

Healthy lighting design with low retinal blue light hazard

Indoor localization based on optimization via visible light

Investigation of color shift of plastics lenses in LED-based products

Kerf-free wafer slicing and thinning for semiconductor applications

LED encapsulation and integration with Film Assisted Molding technology

Optimization of light efficacy and angular color uniformity by hybrid phosphor particle size for white light-emitting diode

Panel level packaging for LED lighting

Effect of LED supplemental lighting system on the growth of pea shoots

Design and implementation of fine pitch COB LED display

Synthesis and luminescence properties of blue light excited red phosphor SrLa2 - xZnO5:Eux (x = 0.001 ∼ 0.2) for white LED

Highly improve photochemical and thermal stability of quantum dots by growing a core-in-matrix hetero-structure

Basic evaluation framework for energy-saving and environment-friendly measurements (ESEFM) in LED lighting projects

The comparative study on thermal performance and life time of liquid cooling LED bulb lamp and traditional LED bulb lamp

The mechanism of modification effect of MoO3 on Al anode of top-emitting organic light-emitting device

Thermal characterization of a printed circuit board with thermal vias for the application of high brightness light-emitting diodes

Thermal transient testing of LEDs: A technique enabling the design and manufacturing of reliable SSL products

Voltage-temperature coefficient analysis and testing of high power light-emitting diodes

Optical characterization of a light bulb with the waffle pack LED WLP module

Integrated analog dimming controller for 0–10V dimming system

Study on thermal degradation of high power LEDs during high temperature and electrical aging

Validation of the methodology of lumen depreciation acceleration of LED lighting

SMT practices with compact pad size LEDs

Methods for assessing the colour fidelity of light sources

White LED light emission as a function of current and junction temperature

Cross-cultural similarities in the visibility of the stroboscopic effect

Cost-effective solid state lighting based on GaN-on-Si technology

A novel self bias supply scheme in LED lighting

An optimal peak current mode control scheme for critical conduction mode (CRM) Buck PFC converter

Environmental influence on background luminance preference of computer use at home

Thermal analysis and optimization design of LED streetlight module

Preliminary exploration on visual ergonomics in LED illumination and national standard system framework for visual ergonomics

Key technology development and future prospect for high-voltage Light-Emitting Diodes

Thermal analysis for silicon-based integration of LED systems

Removing the LED light strobe flicker by proper driver designs

A study on estimating discomfort glare caused by LED road lights

Fabrication of indium tin oxide film with controllable surface morphology via oxygen participant electron-beam evaporation technique

The application and the mechanism of particle heat radiating based on the near field resonance

Assessing glare based on LED lighting

Assessing scene brightness and glare by an imaging system possibility of appearance-based lighting evaluation

Cost-effective and eco-friendly LED system-on-a-chip (SoC)

Enhancement of the light extraction efficiency of flip-chip light-emitting diodes fabricated on patterned silicon carbide and sapphire substrates

Ab initio calculation on group III ad-atoms diffusion on non-polar gallium nitride surface

Crystal quality improvement of Gallium Nitride on plane Sapphire by predose method

Tandem white OLED with low driving voltages using a novel electron transporting material

Light-emitting diodes on Si (110) substrate

ZigBee-based LED intelligent lighting control system

The thermal interchangeability for modularized product of street light

A study of flip-chip direct attachment LED COBs with metal core print circuit boards

Light distribution function application in LED direct backlight unit

A design method of flyback LED driver power supply transformer

Designed of LED dimming system based on the STM32

Designed of new LED dimming system based on the AVR

A typical light distribution design in the high efficient LED street lamp

The impact of LED on human visual experience

Evaluation of colour fidelity based colour rendering indices

Analysis of GaN based LED performance before and after the ESD shock

Influence of SiO2 or SiNx passivation on the electrical properties of GaN-based nanorod LEDs

Thermal stress analysis and structural design of AlxGa1−xN/GaN epilayers based on Si substrate

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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