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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Rafi-Ul-Islam, S.M. Subrina, S. |
| Copyright Year | 2015 |
| Description | Author affiliation: Dept. of Electr. & Electron. Engineerin, Bangladesh Univ. of Engineeringand Technol., Dhaka, Bangladesh (Rafi-Ul-Islam, S.M.; Subrina, S.) |
| Abstract | In this paper, a thermal model of an embedded system consisting of MOSFET, MESFET and HFET is presented in Nano-electronic system by using FEM (Finite Element Method). This model is used to analyze the thermal effects of an embedded system and to solve the associated thermal problems by using Graphene heat spreader on different positions of the embedded system. This paper also suggests the best position of graphene heat spreader to ensure maximum reduction of temperature of the electronic devices. As high temperature sets a limit to the reliability of the devices, such modeling is very useful for the optimization of an embedded system to guarantee a longer lifespan and a better reliability. |
| Starting Page | 441 |
| Ending Page | 445 |
| File Size | 804046 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781467392563 |
| e-ISBN | 9781467392570 |
| DOI | 10.1109/EICT.2015.7391993 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-12-10 |
| Publisher Place | Bangladesh |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Heat spreader Graphene Embedded system Thermal Management |
| Content Type | Text |
| Resource Type | Article |
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