NDLI: An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Bhopte, Siddharth Seshu, B. Desu Sammakia, Bahgat
Copyright Year	2010
Abstract	With the increase in power densities and decrease in chip and electronic package dimensions, their thermal management is a challenge and is a focus of several ongoing research efforts. To achieve the desired thermal management for optimal device operation, heat generated by the chip has to be effectively transferred to the ambient via several structures of the electronic package. Hence the need for development of high thermal conductivity structures is of prime importance. Heat spreaders quickly spread the heat generated by the chips over a larger area from where it is conducted to the ambient via heat sink. Heat-spreading research from a materials view point involves direct combination of high thermal conductivity materials within the microprocessor substrate. In this paper, a novel nano heat spreader design is proposed. Highly conductive graphene layer is integrated on a silicon carbide substrate on one side and thin films of carbon nano tubes as thermal interface material on the other side. Analytical solutions and case studies are presented to show that the proposed approach for the heat spreader design can yield very high effective thermal conductivity while remaining mechanically flexible, as required for reducing thermal stresses.
Sponsorship	Heat Transfer Division
Starting Page	629
Ending Page	635
Page Count	7
File Format	PDF
ISBN	9780791849385
DOI	10.1115/IHTC14-22918
e-ISBN	9780791838792
Volume Number	2010 14th International Heat Transfer Conference, Volume 3
Conference Proceedings	2010 14th International Heat Transfer Conference
Language	English
Publisher Date	2010-08-08
Publisher Place	Washington, DC, USA
Access Restriction	Subscribed
Subject Keyword	Flat heat pipes Nanotubes Dimensions Electronic packages Carbon Heat flux Design Thin films Heat Electronic systems Graphene Thermal conductivity Thermal management Silicon Heat sinks Thermal stresses
Content Type	Text
Resource Type	Article

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