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| Content Provider | IEEE Xplore Digital Library | 
|---|---|
| Author | Weldezion, A.Y. Grange, M. Pamunuwa, D. Jantsch, A. Tenhunen, H. | 
| Copyright Year | 2013 | 
| Description | Author affiliation: Electron. Syst., KTH R. Inst. of Technol., Kista, Sweden (Weldezion, A.Y.; Jantsch, A.; Tenhunen, H.) || Calibre Div., Mentor Graphics, Wilsonville, OR, USA (Grange, M.) || Dept. Electr. & Electron. Eng., Univ. of Bristol, Bristol, UK (Pamunuwa, D.) | 
| Abstract | This paper describes a powerful simulation platform that enables accurate simulations of numerous network configurations under realistic traffic patterns to predict the performance and power needs of a 3-D integrated system early in the design flow. The simulation platform can model virtually any sized 2-D or 3-D network configuration, providing low-cost and fast tradeoff evaluations of various systems architectures. The network simulator uses scalable RTL-level models that can be used for accurate power and timing analyses. We demonstrate the capability of our simulation model by analyzing the performance of various network topologies under spatio-temporal traffic patterns to show how the network topology can be adjusted to meet the performance requirements of a design before it is manufactured. The simulation results can be used to optimize the placement of cores and communication buses early in the flow. By using the model, standard applications such as mobile application processor, femto-cell base-stations on-chip and wide-IO TSV memory stacking can be simulated. | 
| Sponsorship | IEEE Components, Pack., Manuf. Technol. Soc. | 
| Starting Page | 1 | 
| Ending Page | 5 | 
| File Size | 466424 | 
| Page Count | 5 | 
| File Format | |
| ISBN | 9781467364843 | 
| DOI | 10.1109/3DIC.2013.6702365 | 
| Language | English | 
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Publisher Date | 2013-10-02 | 
| Publisher Place | USA | 
| Access Restriction | Subscribed | 
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) | 
| Subject Keyword | Solid modeling Analytical models System-on-chip Data mining Through-silicon vias Integrated circuit modeling Monitoring | 
| Content Type | Text | 
| Resource Type | Article | 
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