NDLI: New Methods Help Better Evaluate Risks Via Simulation

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2012 7th International Conference on Integrated Power Electronics Systems (CIPS)

Advanced Cooling for Power Electronics

Electromagnetic Modeling of EMI Input Filters

Calculating Transient Thermal Load of ECUs in Engine Compartment by Applying Simplified Physical Models

Comparative Evaluation of Individual and Coupled Inductor Arrangements for Input Filters of PV Inverter Systems

Analysis and Reduction of Radiated EMI of Power Modules

The performance of the multilevel converter topologies for PV inverter

Integrated Power Electronics Interface for Plug-In Hybrid Electric Vehicle Applications

Reliability of Power Electronics Under Thermal Loading

Reliability driven virtual prototyping of power electronic equipment - a case study

New Methods Help Better Evaluate Risks Via Simulation

Separating Failure Modes in Power Cycling Tests

In-situ Bond Wire and Solder Layer Health Monitoring Circuit for IGBT Power Modules

Thermal Networks for Time-Variant Cooling Systems: Modeling Approach and Accuracy Requirements for Lifetime Prediction

Lifetime Evaluation of IGBT Power Modules Applying a Nonlinear Saturation Voltage Observer

Influence of thermal cross-couplings on power cycling lifetime of IGBT power modules

Combined Reliability Testing: An approach to assure reliability under complex loading conditions

System Approach for Reliability of Low-power Power Electronics; How to Break Down into Their Constructed Parts

Influence of Bonding Parameters on the Reliability of Heavy Wire Bonds on Power Semiconductors

Microstructural and Mechanical Characterization of Ceramic Substrates with Different Metallization for Power Applications

Reliability of Large Area Solder Joints within IGBT Modules: Numerical Modeling and Experimental Results

Effect of Input Power Interruptions on Power Electronics Reliability

Efficient nonlinear inductors for PV inverters and active PFC

A 150kW Medium Frequency Transformer Optimized for Maximum Power Density

Integration of Leakage Inductance in Tape Wound Core Transformers for Dual Active Bridge Converters

Laminated Bus Bar Structure for Low Induced Noise

Integrated, High-Frequency DC-DC Converter Technologies Leading to Monolithic Power Conversion

Micro-fabricated thin-film inductors for on-chip power conversion

Radial-Anisotropy Thin-Film Magnetic Material for High-Power-Density Toroidal Inductors

An Improved Parasitic Capacitance Cancellation Method for Planar Differential Mode Inductor in EMI Filters

Hybrid Integrated EMC filter for CM and DM EMC Suppression in a DC-DC Power converter

Integrated High Power Modules

Alternative lead free die attach for power module packaging

Reducing Parasitic Electrical Parameters with a Planar Interconnection Packaging Structure

New assembly and interconnect technologies for power modules

Direct cooled modules - integrated heat sinks

Stacked substrates for high voltage applications

SiC and GaN Devices - Competition or Coexistence?

Holistic Approach to Maximize Power Density in Industrial Inverter Designs

Integrated Anti-Short-Circuit Safety Circuit in CMOS SOI for Normally-On JFET

Electrical Analysis and Packaging Solutions for High-Current Fast-Switching SiC Components

Design of an integrated power converter in Wide Band Gap for harsh environments

Reducing expenditure with cooling in renewable power conversion systems with innovative SiC switches

3-Dimensional, Solder-Free Interconnect Technology for High-Performance Power Modules

Reliability of Silver Sintering on DBC and DBA Substrates for Power Electronic Applications

Low-pressure (< 5 MPa) Low-temperature Joining of Large-area Chips on Copper Using Nanosilver Paste

Sintered Silver Joint Strength Dependence on Substrate Topography and Attachment Pad Geometry

Thermo mechanical Reliability of Low-temperature Low-pressure Die Bonding Using Thin Ag Flake Pastes

Planar Interconnect Technology for Power Module System Integration

Reliability of Planar SKiN Interconnect Technology

SiC Device and Power Module Technologies for Environmentally Friendly Vehicles

Control of Primary Active Rectifiers of Traction Converter with Medium-Frequency Transformer: Benefits of Control Unit Combining DSP and FPGA

Scalable High Insulation Power Supply for Medium Voltage Power Converters

Amplitude Modulated Resonant Push-Pull Driver for Piezoelectric Transformers in Switching Power Applications

Asymmetrical Parasitic Inductance Utilized for Switching Loss Reduction in Power Modules

Thermal Management Concepts for Power Sandwich Industrial Drive

Reliable Integration of Double-Sided Cooled Stacked Power Switches based on 70 micrometer Thin IGBTs and Diodes

Influence of baseplate design on cooling performance and reliability

Comparison between electromagnetic and thermal stress induced by Direct Current flow in IGBT bond wires

Centrifugal Formulation of Percolating Thermal Underfills for Flip-Chip Applications

Development and Testing of Cold gas Sprayed Circuit Boards for Power Electronics Applications

Development of high temperature packaging technologies for SiC power devices based on finite elements simulations and experiments: thermal approach

Mixed-Signal and Smart-Power Capable Hybrid Structured ASIC for Cost-Aware Single-Chip Integration of Industrial Applications

Design Considerations of Very Low Profile Coupled Inductors for Flexible Photovoltaic Module

Design of a PCB Rogowski Coil based on the PEEC Method

Wafer-level fabrication of high-power-density MEMS passives based on silicon molding technique

Hybrid Hydraulic Piezo Actuator and its Control for Camless Internal Combustion Engines

Reliability Comparison of a Dual Boost and a Triangular Current Mode Resonant-Transition PFC Converter Topology

EMI Prediction of Power Converters using Switching Waveform Analysis

Consideration of Electrical Parasitics in Conjunction with Thermal Behaviour of Power Semiconductor Components

GaN-over-Si: The Promising Technology for Power Electronics in Automotive

How to Control SiC BJT with High Efficiency?

Application of eGaN FETs for highly efficient Radio Frequency Power Amplifier

Sinter materials for broad process windows in DCB packages - concepts and results

Quality evaluation for silver sintering layers in power electronic modules

Evaluation of silver-sintering die attach

Extreme efficiency power electronics

2010 6th International Conference on Integrated Power Electronics Systems

New Methods Help Better Evaluate Risks Via Simulation

Content Provider	IEEE Xplore Digital Library
Author	Schingale, A. Wolf, D. Schiessl, A. Tarnovetchi, M.
Copyright Year	2012
Abstract	Quite a few tasks focusing on failures of electronic components caused by vibrations have shown that a satisfactory depth of problem analysis cannot be achieved with existing problem-solving methods. Thus, new options supported by computing power have been investigated which make evaluating the stress and reliability of electronic components subject to vibrations faster and more reliable. The paper will give insight into an innovative approach for reliability analysis of electronic components subject to vibration. In order to evaluate the risks from vibration stress to a PCB at the beginning of a project, or even better before, more refined methods are required than those that have been available until now. Sound assumptions from an FEM-based "quick predict" tool should help filling in the gaps during early stages and prevent additional work, higher costs, and even field returns later on. Since the quality of a vibration simulation primarily depends on the quality of the material data, this data needs to be collected. To do so, frequency-dependent material damping models are determined using application-fitting testing arrangements, and then subsequently compared using an appropriate simulation. The lifetime of individual components is essential when estimating the reliability of the entire electronic system, and in this case a list ranking the individual components offers assistance. Since the unit's design has a considerable effect on the actual level of stress in the system, however, it's difficult to determine a generally applicable lifetime for each component. In order to correlate the individual components to one another anyway, the elements are studied using a specifically developed test in coherence with component suppliers. Results are transferred to a database and continuously expanded. Typically, the request of engineering a new electronics system running in harsh environments includes a number of risky assumptions to be made, which today are based on past experience. A system for experts to use for supporting and quantifying these values is closing the gap. To eventually create such a system, we work in close cooperation with university partners.
Starting Page	1
Ending Page	5
File Size	627948
Page Count	5
File Format	PDF
ISBN	9783800734146
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-03-06
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	VDE VERLAG GmbH
Subject Keyword	Vibrations Solid modeling Materials Finite element methods Reliability Stress Graphical user interfaces
Content Type	Text
Resource Type	Article

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