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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Zhi-Yin Lee Devarajan, M. |
| Copyright Year | 2012 |
| Description | Author affiliation: Nano-optoelectronic Lab, School of Physics, Universiti Sains Malaysia, 11800 Penang, Malaysia (Zhi-Yin Lee; Devarajan, M.) |
| Abstract | Generally, the effect of thermal interface material on thermal behavior of system-level light-emitting diode was presented. Application of thermal tape and thermal paste were selected to be applied on the contacting surfaces between package and heat sink. Thermal Transient Tester and T3Ster-Master software were adopted for thermal transient recording and evaluation. From the studies, it was observed that the selection of thermal interface material had a great impact on thermal management of light-emitting diode. Employing thermal paste as boundary condition revealed a reduction of about 6% in junction to ambient thermal resistance compared to thermal tape. In this paper, the thermal responses of the light-emitting diode with corresponding boundary conditions have been clearly discussed in terms of materials properties such as thermal conductivity, thickness and viscosity of the selected thermal interface materials. |
| Starting Page | 1 |
| Ending Page | 2 |
| File Size | 234495 |
| Page Count | 2 |
| File Format | |
| ISBN | 9781457707995 |
| e-ISBN | 9781457707988 |
| DOI | 10.1109/ESciNano.2012.6149690 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2012-01-05 |
| Publisher Place | Malaysia |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Light emitting diodes Electronic packaging thermal management Thermal management Educational institutions Thermal analysis Heat sinks Heat transfer |
| Content Type | Text |
| Resource Type | Article |
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