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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Kovačević, I.F. Drofenik, U. Kolar, J.W. |
| Copyright Year | 2010 |
| Description | Author affiliation: ETH Zurich, Power Electronic Systems Laboratory, Physikstrasse 3, 8092 Zurich, Switzerland (Kovačević, I.F.; Drofenik, U.; Kolar, J.W.) |
| Abstract | In this paper a physical model for lifetime estimation of standard power modules is proposed. The lifetime prediction is based on the assumption that the solder interconnections are the weakest part of the module assembly and that the failure cause is the inelastic deformation energy accumulated within the solder material. Unlike the well-known Coffin-Manson model, the proposed model can be used to physically explain the dependency of lifetime on the various properties of a temperature profile i.e. frequency, dwell-ramp time, minimum/maximum temperature. The model is based on Clech's algorithm for simulation of stress-strain solder response under cyclical thermal loading and on the solder deformation mechanism map used to define the dominant failure mechanism under observed stress-temperature conditions. Either accelerated cycling tests or existing field databases are needed to parameterize the model. To verify the approach, the results of power cycling tests for a high power IGBT module found in literature are applied and the impacts of two mission profiles on the module lifetime are examined. |
| Starting Page | 2106 |
| Ending Page | 2114 |
| File Size | 793191 |
| Page Count | 9 |
| File Format | |
| ISBN | 9781424453948 |
| e-ISBN | 9781424453931 |
| DOI | 10.1109/IPEC.2010.5543755 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-21 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Deformable models Temperature dependence Multichip modules Clech's algorithm Mission profile Failure analysis Life estimation Lifetime estimation Frequency Deformation mechanism map Thermal loading Lifetime modeling Assembly Thermal stresses |
| Content Type | Text |
| Resource Type | Article |
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