NDLI: Effect of nitrogen atmosphere on the soldering process for different types of lead-free solders

Content Provider	IEEE Xplore Digital Library
Author	Schnederle, P. Adamek, M. Szendiuch, I.
Copyright Year	2012
Description	Author affiliation: Department of Microelectronics, Brno University of Technology, Czech Republic (Schnederle, P.; Adamek, M.; Szendiuch, I.)
Abstract	An important part of the microelectronics manufacturing is the reflow process. Even though that the soldering have a long history, the process is still not completely described. Particular still discussed the introduction of the WEEE Directive 2003/108/EC standards and RoHS Directive 2002/95/EC got the soldering received into new areas. There is a space for new material compositions which do not contain lead. Furthermore, a new procedure process, adjusting of equipment and began to make greater use of nitrogen as protective gas. The aim is to compare the already proven commercial solder alloys on different carrier and evaluate more exactly the benefits of nitrogen atmosphere. The evaluation was performed for solder SAC, Sn100C and SnPb solder paste was used as reference. Type of substrates was printed circuit board FR-4 and ceramic substrate. Soldering conducted in atmosphere with different residual oxygen. Results of this paper may serve to increase the quality of soldering classical package as well as BGA and CSP package.
Starting Page	201
Ending Page	206
File Size	4986344
Page Count	6
File Format	PDF
ISBN	9781467322416
ISSN	21612536
e-ISBN	9781467322409
e-ISBN	9781467322393
DOI	10.1109/ISSE.2012.6273139
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-05-09
Publisher Place	Austria
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Substrates Ceramics Atmosphere Metals Nitrogen Cooling
Content Type	Text
Resource Type	Article

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