NDLI: Solder joints properties as function of multiple reflow Vapor Phase Soldering process

Content Provider	IEEE Xplore Digital Library
Author	Branzei, M. Plotog, I. Miculescu, F. Varzaru, G. Svasta, P. Thumm, A.
Copyright Year	2012
Description	Author affiliation: IBL-Löttechnik GmbH, Königsbrunn, Germany (Thumm, A.) \|\| UPB-CETTI, Bucharest, Romania (Plotog, I.; Varzaru, G.; Svasta, P.) \|\| UPB-CEMS, Bucharest, Romania (Branzei, M.; Miculescu, F.)
Abstract	The continuous trend towards high density and miniaturization of electronic devices involves the use of multiple reflow processes in assembling technologies for second level of interconnections in electronic packaging hierarchy. According to the “4P” Soldering Model concept (4PSMC), considering the Pad-Paste-Pin-Process elements as Key Process Input Variables (KPIV), the solder joints are the result of KPIV synergistically interactions and correlations with consequences over their microstructure. In the paper, taking into consideration the cooling rate influence over intermetallic compounds (IMC) formation and microstructure, there was described the investigations over electrical and mechanical properties of solder joints resulted from multiple reflow Vapor Phase Soldering (VPS) process, in terms of 4PSMC. Maintaining the pad, pin and paste of KPIV as references measurements of solder joints resistances and shear forces were perform as function of VPS process's number for two values of cooling rate, respectively IMC microstructures and stereofractography studies. The results of the studies performed and presented in the paper will be use for improving process control in order to assure the solder joints reliability, to minimize losses on VPS lines, to reduce defects number and rework time.
Starting Page	155
Ending Page	160
File Size	382653
Page Count	6
File Format	PDF
ISBN	9781467322416
ISSN	21612536
e-ISBN	9781467322409
e-ISBN	9781467322393
DOI	10.1109/ISSE.2012.6273127
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-05-09
Publisher Place	Austria
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Cooling Resistance Microstructure Electrical resistance measurement Geometry Resistors fractography VPS multiple reflow Shear test IMC microstructure
Content Type	Text
Resource Type	Article

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