NDLI: Comparison of dynamic and static mechanical stress applied on soldered joints

Content Provider	IEEE Xplore Digital Library
Author	Dušek, K. Urbánek, M.
Copyright Year	2010
Description	Author affiliation: Czech Technical University in Prague, Faculty of Electrical Engineering, Department of Electrotechnology, Technická 2, Prague 6, 166 27, Czech Republic (Dušek, K.; Urbánek, M.)
Abstract	This article deals with the mechanical stress of lead free soldered joints. During usage of electrical equipment are found structural changes of soldered joints, which can lead to cracks or failure of the solder joints. Therefore solder joints have influence on a total quality of electronic assembly. Mechanical tests are mainly used for resistance evaluation of components, devices and whole products against stress. This stress takes effect during function, transport and storage of the devices. Mechanical stress can change electrical properties of the soldered joints, e.g. electrical resistance. Even a small change of the electrical resistance could cause the malfunction of the electrical equipment. In this article, the changes of the electrical resistance of dynamic and static stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95,5Ag4Cu0,5) are compared.
Starting Page	204
Ending Page	207
File Size	374587
Page Count	4
File Format	PDF
ISBN	9781424478491
e-ISBN	9781424478507
DOI	10.1109/ISSE.2010.5547292
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-12
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Stress Resistance Lead Environmentally friendly manufacturing techniques Joints Soldering Resistors
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints

Modelling the fatigue life of solder joints for surface mount resistors

Thermal and Mechanical Reliability Tests of Lead - free soldered SMT Joints

Effect of electromigration on mechanical behavior of solder joints

Life-time of lead-free soldered SMT joints

Life-time test of laser soldered joints on flexible boards

Vibration reliability of SMD Pb-free solder joints

The ontology based FMEA of lead free soldering process

Effect of intermetallic stabilization on the impact resistance of joints to BGA packages

Comparison of dynamic and static mechanical stress applied on soldered joints

Similar Documents

Effects of intermetallic compounds on properties of Sn-Cu lead-free soldered joints

Modelling the fatigue life of solder joints for surface mount resistors

Thermal and Mechanical Reliability Tests of Lead - free soldered SMT Joints

Effect of electromigration on mechanical behavior of solder joints

Life-time of lead-free soldered SMT joints

Life-time test of laser soldered joints on flexible boards

Vibration reliability of SMD Pb-free solder joints

The ontology based FMEA of lead free soldering process

Effect of intermetallic stabilization on the impact resistance of joints to BGA packages

Comparison of dynamic and static mechanical stress applied on soldered joints