NDLI: Investigating the increment of deposited solder paste due to uneven PCB Surface

Content Provider	IEEE Xplore Digital Library
Author	Krammer, O. Molnar, L.M. Jakab, L. Klein, C.
Copyright Year	2010
Description	Author affiliation: Automotive Electronics, Engineering Assembly and Interconnect Technology, Robert Bosch GmbH, Stuttgart, Germany (Klein, C.) \|\| Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary (Krammer, O.; Molnar, L.M.; Jakab, L.)
Abstract	The level differences on the PCBs' surface can keep the stencil away from the PCB during stencil printing, which causes large deposited solder paste volume, and can result in solder bridges after reflow soldering. The level differences can be caused by identity decals, or by other artifacts on the PCB. In our experiment the effect of these level differences was investigated. A testboard was designed with solder pads and copper tracks. The thickness of the copper tracks were enlarged selectively by electroplating, thus those kept the stencil away from the PCB. In this way we could investigate the effect of PCB level differences. In the same time another test pattern was designed as well, where small pads were placed in continuously growing distance from an electroplated area. With this test pattern we could investigate the stencil bending, and a minimum distance is determined which should be kept in mind to enable the stencil to bend down to the PCB. The detailed results are presented in the paper.
Starting Page	133
Ending Page	137
File Size	558545
Page Count	5
File Format	PDF
ISBN	9781424478491
e-ISBN	9781424478507
DOI	10.1109/ISSE.2010.5547271
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-12
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Printing Bridges Copper Apertures Springs Reflow soldering
Content Type	Text
Resource Type	Article

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