NDLI: Metallographic analysis of laser soldered chip resistors

Content Provider	IEEE Xplore Digital Library
Author	Hurtony, T. Balogh, B. Pintér, D. Lénárt, G.
Copyright Year	2010
Description	Author affiliation: Department of Electronics Technology, Budapest University of Technology and Economics, Budapest, Hungary (Hurtony, T.; Balogh, B.; Pintér, D.; Lénárt, G.)
Abstract	During the last decade laser material processing has been used in more and more fields of electronics technology. Among these techniques laser soldering processes showed great improvements and they offer several advantages mainly in terms of localized heating, rapid rise and fall in temperature, non-contact and easily automated process. This paper presents a systematic experimental investigation, which was aimed at finding relation between the most significant laser soldering parameters (soldering time and average power) and the intermetallic layer thickness and the microstructure of the solder joint. We applied defocused frequency tripled Nd:YAG laser beam on simple SMD chip resistors. The solder joints were qualified by resistance measurements, X-ray micrographs, shear tests, and the microstructure of the solder joint was analyzed with SEM on cross-section samples.
Starting Page	123
Ending Page	127
File Size	1053433
Page Count	5
File Format	PDF
ISBN	9781424478491
e-ISBN	9781424478507
DOI	10.1109/ISSE.2010.5547269
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2010-05-12
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Laser beams Resistors Laser applications X-ray lasers Microstructure
Content Type	Text
Resource Type	Article

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