NDLI: Quality of PCB Interconnections Based on Blind Microvias Metallized by Magnetron Sputtering Deposition

Content Provider	IEEE Xplore Digital Library
Author	Borecki, J. Felba, J. Posadowski, W.M.
Copyright Year	2006
Description	Author affiliation: Tele & Radio Res. Inst., Warsaw (Borecki, J.)
Abstract	The magnetron sputtering deposition process to metallize the high aspect ratio (deep/diameter) blind microvias was used. In this technique it is innovative that magnetron sputtering deposition process can be used with self-sustaining mode. This mode allows to deposit of very clear (without any labour gas particles) electro-conductive layers (Radzimski et al., 1998). Typically, the thickness of deposited layers is about few micrometers and with success it can be used as electro-conductive connections. However, the thickness of connections can be grown in electroplating processes to decrease its resistance. In the paper the results of first trials of electro-conductive base-layers growing are presented. The big advantage of magnetron sputtering deposition technique is possibility of increasing the aspect ratio of micro-connections in PCBs (printed circuit boards) even several times. This technique was used successfully for metallization of high aspect ratio blind microvias. It was proved that investigated process can be useful in HDI (high density interconnections) PCBs manufacturing.
Starting Page	98
Ending Page	102
File Size	1425515
Page Count	5
File Format	PDF
ISBN	1424405505
DOI	10.1109/ISSE.2006.365366
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-10
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Metallization Sputtering
Content Type	Text
Resource Type	Article

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