NDLI: Visual modelling of physical processes

Content Provider	IEEE Xplore Digital Library
Author	Gordon, P.
Copyright Year	2001
Description	Author affiliation: Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary (Gordon, P.)
Abstract	The development of information technology has also opened new perspectives in modeling and simulation of processes used in electronics packaging technology. In September of 1999 an IEEE/NSF supported Project has been launched for the creation of a virtual laboratory (http://www.ett.bme.hu/vlab or http://www.ewh.ieee.org/mm/cpmt/vlab) environment to present and study equipment, and to promote process modeling and simulation developments. An important additional goal of the project is to support electronics packaging education in order to prepare engineers for the needs of the 21st century. The current phase of the work is the development of simulations and models for laser processing, such as via drilling and patterning of pure and metal finished copper layers on polymeric substrates, e.g. epoxy, polyimide and aramid, which are commonly used for laminated interconnect substrates (Lerner, 1998). The paper describes the virtualized facility of the author's Department and the results of physical model creation efforts and 3D visualization tool developments for laser processing with the application of CO/sub 2/ and frequency multiplied Nd:YAG lasers, using all five wavelengths, i.e. 10600, 1064, 532, 355 and 266 nm.
Sponsorship	Mintr. Educ. & Res.
Starting Page	78
Ending Page	82
File Size	687050
Page Count	5
File Format	PDF
ISBN	0780371119
DOI	10.1109/ISSE.2001.931016
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-05
Publisher Place	Romania
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laser modes Laser theory Electronics packaging Information technology Components, Packaging, and Manufacturing Technology Society Drilling Copper Polymers Polyimides Application virtualization
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Selectively electrical deposition copper on UV laser induced polyimide

Description of 355 nm Laser Ablation of Polyimide as a Thermal Process

Process flow and manufacturing concept for embedded active devices

The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps

Micromachined cell handling devices

Electrical Performance of electronic Packaging

Cost effective small via generation-the laser solution

UV Laser Solutions for Electronic Interconnect and Packaging

Packaging of electronic modules through completely dry process

Visual modelling of physical processes

Similar Documents

Selectively electrical deposition copper on UV laser induced polyimide

Description of 355 nm Laser Ablation of Polyimide as a Thermal Process

Process flow and manufacturing concept for embedded active devices

The 2004 International Electronics Manufacturing Initiative (iNEMI) Technology Roadmaps

Micromachined cell handling devices

Electrical Performance of electronic Packaging

Cost effective small via generation-the laser solution

UV Laser Solutions for Electronic Interconnect and Packaging

Packaging of electronic modules through completely dry process

Visual modelling of physical processes