NDLI: Conductive adhesive-an alternative to solder in SMT

Content Provider	IEEE Xplore Digital Library
Author	Mundlein, M. Nicolics, J. Gehberger, E. Hainzl, H.
Copyright Year	2001
Description	Author affiliation: Inst. of Ind. Econ. & Mater. Sci., Tech. Univ. Wien, Austria (Mundlein, M.)
Abstract	Isotropic conductive adhesives (ICAs) provide an environmentally friendly alternative to solders for interconnections in electronic applications with advantages of low processing temperature and an improved fine pitch capability. However, unstable electrical conductivity under elevated temperature and humidity conditions, and low interconnect impact resistance were major obstacles preventing ICAs from becoming a general replacement for solders in SMT until now. Recently developed ICAs promise improved electrical and mechanical reliability on nonnoble metallizations as conventionally used in SMT and a complete curing during a typical reflow soldering cycle. In our study, selected new generation ICAs from different manufacturers are evaluated combined with the four most common finishes: electroless deposited Sn, Ag, NiAu and an organic solderability preservative (ENTEK Plus). The curing cycles were optimized by monitoring bond electrical conductivity during the curing process. These tests showed onset of conductivity immediately after placing the SMT. Long-term behavior is evaluated by observing the contact resistances during and after exposure of the samples to an elevated temperature/humidity environment (85/spl deg/C/85% RH). Moreover, the results of mechanical strength tests before and after the accelerated aging process are discussed to argue the mechanical long-term behavior. The goal of this study is to discuss advantages and drawbacks of ICAs as a general replacement for solders in SMT and to present some recent progress in ICA technology development.
Sponsorship	Mintr. Educ. & Res.
Starting Page	20
Ending Page	25
File Size	591159
Page Count	6
File Format	PDF
ISBN	0780371119
DOI	10.1109/ISSE.2001.931001
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2001-05-05
Publisher Place	Romania
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Surface-mount technology Independent component analysis Temperature Conductivity Curing Humidity Testing Conductive adhesives Electric resistance Metallization
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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