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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wei-Chung Lo Yu-Chih Chen Yu-Fang Chen Huan-Chun Fu Shu-Ming Chang Li-Cheng Shen Hsu-Tien Hu Kuo-Chuan Chen |
| Copyright Year | 2003 |
| Description | Author affiliation: Adv. Process Technol. Dept., Packaging Process Technol. Div., Hsinchu, Taiwan (Wei-Chung Lo; Yu-Chih Chen; Yu-Fang Chen; Huan-Chun Fu; Shu-Ming Chang; Li-Cheng Shen; Hsu-Tien Hu; Kuo-Chuan Chen) |
| Abstract | Lots of advanced packaging forms were introduced to meet different application by using the solder balls as the interconnect media between chip and substrate. With the environment protection concerns increasing, lead free solders are playing the more and more important role in this area. The properties and characterization between solder joints and dielectric layers are key reliability issues. The present works mainly focuses on the investigation of the quality of dielectric layers for wafer level chip size packages (WLCSP). In this paper, both the negative tone (Durimide 7510/7320) and positive tone (Durimide 9005) photosensitive materials are evaluated as the dielectric layer for the E-WLCSP. In the E-WLCSP, there were two major bumping processes to be introduced here: Ti/Cu/Ni/Au UBM with 63Sn/Pb eutectic solder and Sn/3.8Ag/0.7Cu lead free solder. The target is to choose the most reliable pairs for positive- and negative-tone polyimides, to meet the different bumping process requirement, and pass the reliability test. |
| Starting Page | 574 |
| Ending Page | 577 |
| File Size | 303706 |
| Page Count | 4 |
| File Format | |
| ISBN | 0780382056 |
| DOI | 10.1109/EPTC.2003.1271586 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-12-12 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Environmentally friendly manufacturing techniques Lead Dielectric substrates Packaging Protection Soldering Wafer scale integration Dielectric materials Gold Tin |
| Content Type | Text |
| Resource Type | Article |
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