NDLI: Surface mounting of very fine pitch components: a new challenge

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Surface mounting of very fine pitch components: a new challenge

Content Provider	IEEE Xplore Digital Library
Author	Joly, J. Saint Martin, X.
Copyright Year	1991
Description	Author affiliation: Bull SA, Les Clayes-sous-Bois, France (Joly, J.; Saint Martin, X.)
Abstract	Based on their experience in developing and using 16 and 12.5 mils peripheral pitch custom compact single chip packages, the authors analyze the evolution and today's limits of package and board technologies and assembly techniques, with emphasis on manufacturability. The authors present their manufacturing approach and quality and reliability results when using 16 and 12.5 mils peripheral ceramic leaded packages. A detailed analysis of packaging processes and limitations is performed for high pin count ceramic and plastic packages. Competitive packaging methods, pin grid arrays, land grid arrays, and tape automated bonding are compared, and trends for the future are analyzed.<>
Starting Page	159
Ending Page	162
File Size	472876
Page Count	4
File Format	PDF
ISBN	0780301552
DOI	10.1109/IEMT.1991.279768
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1991-09-16
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Testing Soldering Packaging machines Assembly Manufacturing Ceramics Very large scale integration Silicon Plastic packaging
Content Type	Text
Resource Type	Article

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