NDLI: Investigations of Au-Sn alloys on different end-metallizations for high temperature applications [solders]

Content Provider	IEEE Xplore Digital Library
Author	Anhock, S. Oppermann, H. Kallmayer, C. Aschenbrenner, R. Thomas, L. Reichl, H.
Copyright Year	1998
Description	Author affiliation: Tech. Univ. Berlin, Germany (Anhock, S.)
Abstract	Au-Sn solder is becoming increasingly important in the field of microelectronic packaging. For high temperature and fluxless applications in particular, for example in optoelectronics, Au-Sn solder bumps are used. The Au-Sn solders come in contact with different end-metallization systems such as nickel, platinum or palladium used as underbump-metallization. Information about the Au-Ni-Sn, Au-Pd-Sn and Au-Pt-Sn ternary systems in terms of metallurgical fundamentals are very important for understanding and controlling the technological processes. This knowledge is the base for investigations of reliability, phase formations, growth and stability, diffusion mechanisms and diffusion pathways. This paper summarizes the work done on different Au-Ni-Sn, Au-Pd-Sn and Au-Pt-Sn alloys with maximum 20 at.% Ni, Pd and Pt contents, and investigations on diffusion and interface reactions of Au-Sn solders on Ni, Pd and Pt. Isothermal sections of the solid state are introduced. The presence of unknown Au-Ni-Sn and Au-Pd-Sn phases in the tie-triangle is discussed. Results of diffusion investigations and interface reactions are shown.
Starting Page	156
Ending Page	165
File Size	707256
Page Count	10
File Format	PDF
ISBN	0780345207
DOI	10.1109/IEMTE.1998.723081
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-04-29
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microelectronics Packaging Temperature Palladium Process control Control systems Stability Nickel alloys Platinum alloys Isothermal processes
Content Type	Text
Resource Type	Article

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