NDLI: Run by run (generalized SPC) control of semiconductor processes on the production floor

Content Provider	IEEE Xplore Digital Library
Author	Boyd, J.D. Banan, M.
Copyright Year	1995
Description	Author affiliation: Delco Electron. Corp., Kokomo, IN, USA (Boyd, J.D.; Banan, M.)
Abstract	Multiple linear response surface methodology coupled with run by run (generalized SPC) control has been applied at Delco Electronics to a high volume production epitaxy deposition process. This resulted in nearly a 1.8/spl times/ improvement in process capability for thickness control. This was achieved by interfacing an IBM compatible 486 computer to Gemini II epi reactors, translating Sun workstation Matlab script code from the Massachusetts Institute of Technology into PC compatible Matlab script code, and combining this with the InTouch man machine interface (MMI) software package from Wonderware, Inc. This paper is a case study of our experience at implementing this on the production floor. We discuss the general nature of the process to show why this methodology is relatively easy to apply. Operator training was simplified, data acquisition capability was added, new enhanced modes of operation were implemented, and enhanced capability for more advanced processes is possible on equipment that did not originally provide these features.
Starting Page	60
Ending Page	64
File Size	541931
Page Count	5
File Format	PDF
ISBN	0780329961
DOI	10.1109/IEMT.1995.526093
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1995-10-02
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Process control Production Response surface methodology Epitaxial growth Thickness control Computer interfaces Inductors Sun Workstations Man machine systems
Content Type	Text
Resource Type	Article

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