NDLI: An Environmentally Benign Process Model Development for Printed Circuit Board Recycling

Content Provider	IEEE Xplore Digital Library
Author	Hong-Chao Zhang Xi Ouyang Abadi, A.
Copyright Year	2006
Description	Author affiliation: Dept. of Ind. Eng., Texas Tech Univ., Lubbock, TX (Hong-Chao Zhang; Xi Ouyang)
Abstract	Delaminating and separation of obsolete printed circuit board (PCB) is essential for its recycling. This paper presents an alternative environmentally benign process method for PCB recycling. Applying the solvent system, e.g. carbon dioxide and water under certain pressure and temperature, the PCB scraps could be delaminated easily. The separation of PCB into copper foil, glass fiber and polymer will be beneficial for further PCB recycling. The fundamental experiment mechanism is based on the polymer physics and polymerization. When the process temperature is raised above the polymer glass transition temperature Tg, polymer would be decomposed, which caused the main bonding force among PCB layers greatly reduced. Base on this principle several different processing circumstances were explored, including supercritical carbon dioxide; binary solvent system of $CO_{2}$ and $H_{2}O;$ trinary solvent system of $CO_{2},$ $H_{2}O$ and $CH_{3}CH$ $_{2}OH.$ The experiment facilities were set up and the input & output parameters were defined to evaluate the PCB delaminating result. Utility functions were developed to optimize the process conditions. The recommendations for future study are illustrated at the end of this paper
Starting Page	212
Ending Page	217
File Size	482435
Page Count	6
File Format	PDF
ISBN	1424403510
ISSN	10952020
DOI	10.1109/ISEE.2006.1650063
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-05-08
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Printed circuits Recycling Polymers Solvents Temperature Carbon dioxide Glass Water conservation Copper Physics
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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