NDLI: Evaluation of thermal deformation behavior in electronic package using UV moire interferometry

Content Provider	IEEE Xplore Digital Library
Author	Jin-Hyoung Park Soon-Bok Lee
Copyright Year	2005
Description	Author affiliation: Dept. of Mech. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea (Jin-Hyoung Park; Soon-Bok Lee)
Abstract	In recent years, moire interferometry method has been used extensively in the electronics industry to determine thermal strains caused by temperature changes in microelectronics devices. The size of a flip-chip package has getting smaller. To measure thermal deformations of these small flip-chips, instruments with much higher resolution are required. Many researchers have tried to achieve this resolution enhancement of moire interferometry by using a phase-shifting method. But the phase-shifting method has physical limitations. Fundamentally to get higher resolution, the laser source should be changed. In this article, we constructed a moire interferometry system by utilizing an ultraviolet laser (/spl lambda/=325nm). This UV system realizes higher resolution than He-Ne (/spl lambda/=633nm) system. And we apply this system to evaluate thermal deformation in flip-chip package.
Sponsorship	COE21, Tokyo Inst. of Technol. CASIO Sci. Promotion Found. Kao Found. for Arts and Sci
Starting Page	209
Ending Page	214
File Size	3906641
Page Count	6
File Format	PDF
ISBN	1424401070
DOI	10.1109/EMAP.2005.1598263
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-12-11
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronic packaging thermal management Optical interferometry Wavelength measurement Temperature Packaging machines Diffraction gratings Interference Light sources Electronics industry Capacitive sensors
Content Type	Text
Resource Type	Article

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