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2012 14th International Conference on Electronic Materials and Packaging (EMAP)

2008 International Conference on Electronic Materials and Packaging

2007 International Conference on Electronic Materials and Packaging

2006 International Conference on Electronic Materials and Packaging

2005 International Symposium on Electronics Materials and Packaging

Table of contents

The story behind the red phosphorus mold compound device failures

Semiconductor integrated circuit packaging technology challenges - next five years

Gbps signal transmission on Si CMOS ULSI

A study of hygro-thermal deformations and stresses in FCPBGA

Development of an automated X-ray inspection method for microsolder bumps

Reliability assessments of BGA solder joints under cyclic bending loads

Case studies of reliability analysis by stochastic methodology in BGA creep analysis

Fatigue crack propagation analysis for microsolder joints with void

Reliability analysis of embedded chip technique with design of experiment methods

A role of Ti-Sn diffusion layer formed at the interface between Pb free solder and TiNiAu multilayer

In situ observation of interfacial fracture in low-dimensional nanostructures

Effect of frequency on fatigue crack growth along interface between copper film and silicon substrate

Effect of lead and cadmium free glasses on reliability of the silver end termination for MLCC application

The study of silicon dies stress in stacked die packages

A multifunctional test chip for microelectronic packaging and its application on RF property measurements

Strain measurement in the microstructure of advanced electronic packages using digital image correlation

Effects of Au and Ni layer thicknesses on the reliability of BGA solder joints

Studies on double-layered metal bumps for fine pitch flip chip applications

Dynamic characterization study of flip chip ball grid array (FCBGA) on peripheral component interconnect (PCI) board application

Stability of Ni/sub 3/P and its effect on the interfacial reaction between electroless Ni-P and molten tin

Investigation of void-free electroplating method on copper column based solder bump for flip-chip interconnections

Characterization of Au-Sn eutectic die attach process for optoelectronics device

Propagation loss evaluation of optical transmission/interconnect system with grating structure

A new method of birefringence measurement to obtain stress field using photoelasticity

Optimization of epoxy flow for passive alignment of optical fiber arrays

Study on long life large-deflective hinges in molded pantograph mechanisms based on cyclic load-bending fatigue test

Warpages of ACF-bonded COG packages induced from manufacturing and thermal cycling

Simulation of tensile deformation behavior of polymer by chain network model

Effects of the functional groups of nonconductive films (NCFs) on materials properties and reliability of NCF flip-chip-on-organic boards

Effects of low-modulus die attach adhesive on warpage and damage of BGA

Hardness and elastic modulus of ZnO deposited materials by PLD method

Mechanical properties of ITO/PET thin film deposited by DC MG method

Formation and characterization of sputtered thin film for optimizing multilayered interconnection structure

Development of the embedded LSI technology in PALAP/spl trade/

Wafer-scale BCB resist-processing technologies for high density integration and electronic packaging

Microscale magnetic components for the application of DC-DC converters operating in the 1-10 MHz range

Low-cost active-alignment of single-mode fiber-arrays

SAW chemical sensors based on AlGaN/GaN piezoelectric material system: acoustic design and packaging considerations

Evaluation of thermal deformation behavior in electronic package using UV moire interferometry

Evaluation of fatigue strength for solder joints after thermal aging

Local thermal deformation and residual stress of a thin Si chip mounted on a substrate using an area-arrayed flip chip structure

The novel flip chip ball grid array design and challenges to enable higher routing density and power requirement

Fatigue crack growth in lead-free solder joints

A study of hot spot in silicon device for stacked die packages

Modelling the lamination process for ruggedised displays

Modelling and simulation of a fluid-driven microturbine

Stress intensity factors of interface corners

The impact of capacitors selection and placement to the ESL and ESR

Evaluation of drop impact load for portable electronic components

Nonlinear dynamic behavior of thin PCB board for solder joint reliability study under shock loading

Turbulence modelling for electronic cooling: a review

Heat conduction in composites of thermally dissimilar materials - a methodology to economize numerical heat transfer analysis of electronic components

Critical appraisal of thermo-mechanical reliability of medium-power heterojunction bipolar transistors for base station and military applications mounted in SOIC-8 leadframe based plastic overmold packages with conductive silver epoxy

A study in establishing flip-chip ball grid array (FCBGA) second level interconnect (SLI) reliability requirement by CFD simulation

Electro-thermal analysis of device interactions in Si CMOS structure

Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.

Advances in Electronic Materials and Packaging 2001 (Cat. No.01EX506)

International Symposium on Electronic Materials and Packaging (EMAP2000) (Cat. No.00EX458)

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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