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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Fillo, J. Jiayuan Fang Lehmann, G. Srihari, H. Sammakia, B. |
| Copyright Year | 1999 |
| Description | Author affiliation: Sch. of Eng. & Appl. Sci., State Univ. of New York, Binghamton, NY, USA (Fillo, J.) |
| Abstract | A packaging course, totally new in concept, is proposed that will not only serve Binghamton students, but serve as a new paradigm for an integrated fundamentals of packaging course. What we propose is a graduate level, interdisciplinary packaging course, structured on the product development cycle for electronic packaging. The course will expose students to the nature of teaming, the role of market analysis and research, and the three key stages to bring to market a successful product: design; development; and production. The course will be developed to fulfil a partial requirement for students interested in pursuing a graduate concentration in packaging. Mechanical, electrical, manufacturing and industrial engineering disciplines are targeted for this course. The course will be developed in the form of modules, each of which will consist of a specific technical topic related to one of the disciplines described above. For example in the area of mechanical engineering typical modules may include: structural mechanics, photo mechanics, thermal management, fatigue, creep...etc. The course is by necessity multi-disciplinary and will therefore be developed jointly by faculty from several different engineering departments. The course will be initially offered on campus for the first semester, but will then be documented into a multi-media format that can be accessed via the Internet. The course will also be formatted in a way that makes it possible to offer combinations of some of the modules as short courses and also as workshops. These would be offered as specific topical courses for professionals in industry interested in a specific technical issue. |
| Starting Page | 1074 |
| Ending Page | 1078 |
| File Size | 420885 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780352319 |
| ISSN | 05695503 |
| DOI | 10.1109/ECTC.1999.776322 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 1999-06-01 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Internet Electronics packaging Thermal management Consumer electronics Product development Product design Production Manufacturing Industrial engineering Mechanical engineering |
| Content Type | Text |
| Resource Type | Article |
| Subject | Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering |
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