NDLI: High density, low parasitic direct integration by fluidic self assembly (FSA)

Content Provider	IEEE Xplore Digital Library
Author	Smith, J.S.
Copyright Year	2000
Description	Author affiliation: California Univ., Berkeley, CA, USA (Smith, J.S.)
Abstract	Fluidic self assembly is a novel technique for accurately assembling large numbers of very small devices. The resulting assemblies are planar, and planarization and metallization of the assemblies result in demonstrated interconnect densities of greater than 50 interconnects per millimeter of perimeter, or a density of 10/sup 5/ per cm/sup 2/ with multilevel metallization. This high density is possible due to the planar structure, and an alignment precision of /spl plusmn/1 micron. The small size of the interconnects also results in very low parasitic capacitance, comparable to on die traces. Demonstrated yields are 0.9999 for assemblies with thousands of elements. This paper will discuss this recent progress in self assembly technology, and applications including integration of high capacity optoelectronic I/O devices.
Starting Page	201
Ending Page	204
File Size	598172
Page Count	4
File Format	PDF
ISBN	0780364384
DOI	10.1109/IEDM.2000.904292
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2000-12-10
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Very large scale integration Surface treatment Costs Chemicals Silicon Frequency Optoelectronic devices Antenna arrays Robotic assembly Shape
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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