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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jaemin Shin Aygun, K. |
| Copyright Year | 2007 |
| Description | Author affiliation: Intel Corp., Chandler (Jaemin Shin; Aygun, K.) |
| Abstract | Multi-gigabit input/output (I/O) links on printed circuit boards (PCBs) suffer from high-frequency signal attenuation, necessitating equalization to restore the transmitted waveforms. Whereas active transmitter or receiver equalization circuits consume significant power, equalizers composed exclusively of passive devices can achieve good signal integrity with no active power dissipation. Recent advances in packaging technology allow passive devices to be integrated directly into the substrate, thereby freeing area in the die or on the motherboard that would otherwise have been needed for the equalizer. In this paper, we are reporting the first, experimental demonstration of continuous-time linear equalizers (CTLEs) using embedded passive components up to 10 gigabit per second (Gbps). We have designed, optimized and fabricated three different equalizers using embedded passives technology. These devices were employed to a equalize board-level interconnect suffering from frequency-dependent loss. We have then validated the performance of the CTLEs in the frequency and time domains. |
| Starting Page | 147 |
| Ending Page | 150 |
| File Size | 3126533 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424408832 |
| DOI | 10.1109/EPEP.2007.4387146 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-10-29 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Equalizers Printed circuits Attenuation Signal restoration Transmitters Power dissipation Packaging Integrated circuit technology Design optimization Integrated circuit interconnections |
| Content Type | Text |
| Resource Type | Article |
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