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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Swirbel, T. |
| Copyright Year | 2004 |
| Description | Author affiliation: Motorola, Inc., Plantation, FL, USA (Swirbel, T.) |
| Abstract | Advances in the capability of IC packaging, component technologies, and printed circuit board manufacturing has given wireless product designers the ability to develop highly functional devices in small form factors. Technologies such as 2D and 3D chip scale packages (CSP), 0201 microcomponents, high density circuit boards, and embedded/integrated substrates have enabled portable wireless products with digital pad densities greater than 600 pads/in/sup 2/ when only two years ago pad densities were <350 pads/in/sup 2/. This paper discusses the methodology developed and tools deployed to select the appropriate component technology and enable high-density physical designs. It provides an in-depth look at the system-level approach used to enable high-density designs in 3G and iDEN/spl reg/ wireless phones and public safety radios which integrate high pin count 0.5 mm micro-BGAs, multi-layer high density interconnect printed circuit boards, and 0201 chip components. |
| Starting Page | 1148 |
| Ending Page | 1152 |
| File Size | 754240 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780383656 |
| DOI | 10.1109/ECTC.2004.1319486 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2004-06-04 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Design methodology Components, packaging, and manufacturing technology Printed circuits Integrated circuit technology Chip scale packaging Integrated circuit packaging Product design Appropriate technology Safety Integrated circuit interconnections |
| Content Type | Text |
| Resource Type | Article |
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