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Content Provider | IEEE Xplore Digital Library |
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Author | Coperich, K.M. Ruehli, A.E. Cangellaris, A. |
Copyright Year | 1999 |
Description | Author affiliation: Illinois Univ., Urbana, IL, USA (Coperich, K.M.) |
Abstract | A convenient skin effect model for the partial element equivalent circuits (PEEC) technique is the so-called volume filament technique. This approach is an integral part of the basic PEEC model if the conductor cross-sections are subdivided into cells. This model is efficient for geometries and frequencies where the skin depth is moderate compared to the conductor thickness. However, the computational cost may be too high for the case where the skin depth is a small fraction of the cross-section, especially if it is subdivided into uniform cells. In this paper, a model is presented that is suitable for all frequency regimes of interest, and thus is most appropriate for transient interconnect analysis using a full-wave model denoted as (Lp, P, Z/sub s/, /spl tau/)PEEC, to indicate the inclusion of the complex skin effect model Z/sub s/. |
Starting Page | 189 |
Ending Page | 192 |
File Size | 293803 |
Page Count | 4 |
File Format | |
ISBN | 0780355970 |
DOI | 10.1109/EPEP.1999.819223 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 1999-10-25 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Skin effect Equivalent circuits Frequency Conductors Power system transients Transient analysis Electronics packaging Current distribution Current density Solid modeling |
Content Type | Text |
Resource Type | Article |
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