NDLI: Electronic packaging for microwave multichip modules

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Electronic packaging for microwave multichip modules

Content Provider	IEEE Xplore Digital Library
Author	Piloto, A.J.
Copyright Year	1999
Description	Author affiliation: Kyocera America, San Diego, CA, USA (Piloto, A.J.)
Abstract	Summary form only given. Modern radio frequency (RF) systems including radar/electronically scanned arrays are electronic systems in which MCMs are beginning to be applied. Conventional radars/RF systems generally have been operated at frequencies of about 220 MHz to 94 GHz, a spread of over eight octaves. The development of monolithic microwave integrated circuit (MMIC) and application specific integrated circuit (ASIC) semiconductor technology has given rise to wider spread usage of analog and mixed mode (analog and digital) MCM designs within the major segments of the RF system. The challenge to MCM design is the incorporation of passive and active RF and DC components within a single MCM and the relationship between the materials, mechanical design and electrical performance of the MCM. As microwave semiconductor technology continues to evolve, so shall the demand on all aspects of analog and mixed mode MCMs.
File Size	105685
File Format	PDF
ISBN	0780355970
DOI	10.1109/EPEP.1999.819181
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1999-10-25
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Electronics packaging Multichip modules Radio frequency Application specific integrated circuits Radar MMICs Microwave technology Analog integrated circuits Microwave integrated circuits Monolithic integrated circuits
Content Type	Text
Resource Type	Article

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