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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Dugger, M. T. Groysman, D. Celina, M. C. Alam, T. M. Argibay, N. Nation, B. L. Prasad, S. V. |
| Copyright Year | 2014 |
| Description | Author affiliation: Materials Science and Engineering, and Engineering Design and Integration Centers Sandia National Laboratories Albuquerque, New Mexico, USA (Dugger, M. T.; Groysman, D.; Celina, M. C.; Alam, T. M.; Argibay, N.; Nation, B. L.; Prasad, S. V.) |
| Abstract | The degradation in electrical contact resistance of a contact pair sliding while submerged in silicone fluid has been investigated. While the contamination of electrical contacts by silicone vapors or migrating species at elevated temperature due to decomposition in electric arcs is well known, the present degradation mechanism appears to arise from chemical reactions in the silicone fluid at room temperature, catalyzed by the presence of the freshly-abraded metal surface. As a result of these reactions, a deposit containing Si, C and O forms in the vicinity of mechanical contact. The specific contact metals present and the availability of dissolved oxygen in the fluid have a dramatic influence on the quantity of reaction product formed. The chemistry of the deposit, proposed formation mechanisms, the impact on electrical contact resistance and mitigation strategies are discussed. |
| Starting Page | 1 |
| Ending Page | 6 |
| File Size | 783554 |
| Page Count | 6 |
| File Format | |
| e-ISBN | 9781479960682 |
| DOI | 10.1109/HOLM.2014.7031029 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2014-10-12 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Fluids Contacts Vibrations Surface treatment Copper Nuclear magnetic resonance friction polymer silicone palladium copper |
| Content Type | Text |
| Resource Type | Article |
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