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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Temborius, S. Lindmayer, M. Gentsch, D. |
| Copyright Year | 2000 |
| Description | Author affiliation: Inst. fur Nachrichtentech., Tech. Univ. Braunschweig, Germany (Temborius, S.) |
| Abstract | In the past years the vacuum switching principle has gained wide acceptance in medium voltage systems. While vacuum circuit breakers, where high short-circuit currents have to be mastered, nearly exclusively utilize CuCr25wt.-% to 50wt.-% as contact material, the choice in vacuum interrupters for switching lower load currents (e.g. contactors) is less definite. The material must meet the requirements of low erosion losses on a high number of switching operations, low chopping currents, low tendency to generate HF transients and a satisfying quenching capability as well. Often materials based on refractory components are used, such as WCu, MoCu, WCAg, but also CuCr seems applicable. The aim of this work has been to investigate such contact materials with respect to their interrupting behavior on load and overload conditions. The experiments were carried out with a vacuum test chamber in a synthetic test circuit. The contacts were stressed by arc currents up to 7 kA/sub RMS/ and a transient recovery voltage of 23 kV/sub peak/. Different contact materials have been compared with respect to their breaking capability and the state of their contact surfaces after arcing by means of scanning electron microscopy. |
| Starting Page | 519 |
| Ending Page | 523 |
| File Size | 433100 |
| Page Count | 5 |
| File Format | |
| ISBN | 0780357914 |
| DOI | 10.1109/DEIV.2000.879041 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2000-09-18 |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Interrupters Circuit testing Medium voltage Power system transients Vacuum systems Circuit breakers Electrons Insulation testing Transient analysis Elementary particle vacuum |
| Content Type | Text |
| Resource Type | Article |
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