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Content Provider | IEEE Xplore Digital Library |
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Author | Forli, L. Portal, J.M. Nee, D. Borot, B. |
Copyright Year | 2004 |
Description | Author affiliation: L2MP-Polytech, UMR CNRS, Marseille, France (Forli, L.; Portal, J.M.) |
Abstract | This paper presents a test chip and infrastructure IP (I-IP) solutions to accelerate process development of interconnects on new advanced technology and to improve the back-end-of-line (BEOL) yield on products. The test chip and the I-IP use the same architecture which is described in using a bottom-up approach with emphasis on its scalability. Using this test chip, the specifications of process back-end critical parameters can be quickly and easily analyzed. Using the dedicated infrastructure IP, the defect density tracking as well as the test and diagnosis of process back-end critical parameters can be rapidly and simply performed. To reach this goal, the test flow and its related signature extraction are given. Moreover, each extracted signature is merged in a database which are used to diagnose defected back-end parameters in the I-IP. Thus, the use of the test chip and the I-IP allows us to improve the manufacturing process from the beginning of a new technology development and integration to the end of ramp-up production and product manufacturing. |
Starting Page | 77 |
Ending Page | 82 |
File Size | 926114 |
Page Count | 6 |
File Format | |
ISBN | 0780387775 |
DOI | 10.1109/ICCDCS.2004.1393357 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2004-11-03 |
Publisher Place | Dominican Republic |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Testing Manufacturing processes CMOS technology Failure analysis Production Semiconductor device manufacture Monitoring Portals Life estimation Scalability |
Content Type | Text |
Resource Type | Article |
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