NDLI: Thermal-structural reliability assessment of helix TWT interaction circuit using finite element analysis

Content Provider	IEEE Xplore Digital Library
Author	Rocci, P.J.
Copyright Year	1993
Description	Author affiliation: US Air Force Rome Lab., Griffiss AFB, NY, USA (Rocci, P.J.)
Abstract	Finite element analysis (FEA) techniques were used to assess the mechanical performance due to thermal loading of a high power, wide band, helix traveling wave tube's interaction (slow wave) circuit. A steady state heat transfer analysis was performed using calculated heat dissipations and boundary temperatures that were obtained through data supplied by the TWT's manufacturer. The resulting temperatures from this analysis were used as loading conditions in a linear static analysis of a smaller model which represents a 12 turn section of the circuit. The failure modes investigated were cracking of the helix tape and fracture of the support rods due to excessive thermal stresses. Cracking of the helix tape would cause an open-circuit to occur while fracture of the support rods could cause small mechanical perturbations in the slow wave structure which may reflect the RF signal. Both cases could possibly lead to electrical failure of the TWT. Static stress analysis of the attenuation section indicated that the stress levels in the helix and support rods due to this particular temperature gradient were within acceptable limits and would not fracture if these components were free of initial cracks or flaws. Stresses through the helix were sufficient to nucleate cracks, however the length of these cracks would be minute and would not affect the useful life of the helix.<>
Starting Page	731
Ending Page	737
File Size	575701
Page Count	7
File Format	PDF
ISBN	0780312953
DOI	10.1109/NAECON.1993.290849
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-05-24
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Temperature Thermal stresses Performance analysis Circuits Heat transfer Finite element methods Thermal loading Wideband Steady-state Manufacturing
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in