NDLI: Overlay Control Requirements for Immersion Lithography

Content Provider	IEEE Xplore Digital Library
Author	Eichelberger, B. Adel, M. Izikson, P. Tien, D. Huang, C.K. Robinson, J.C. Herrera, P.
Copyright Year	2008
Description	Author affiliation: KLA-Tencor Corp., Milpitas, CA (Eichelberger, B.)
Abstract	Immersion lithography has been developed to meet the requirements of shrinking design rules. With it are new sources of variability and challenges which need to be understood and characterized in order to gain the most from the innovative lithography technique. This paper will focus on the immersion overlay challenges by providing a comprehensive source of variance (SOV) study of 193 immersion scanners. We will compare scenarios of 'single machine' and 'single generation matching' using wafers processed through 193 nm immersion lithography tools. An ultra-dense sampling strategy is used to provide the data necessary to extract accurate conclusions regarding field and wafer (also referred to as "grid"), information. These measurements are then processed to determine the overlay SOV. The SOV analysis is broken down into wafer, field, and un-modeled components. A variety of overlay models and sampling schemes are then presented to illustrate how one can optimize the overlay control strategy to yield the required overlay residuals while providing the measurement robustness and throughput necessary for a high volume manufacturing environment. Finally conclusions will be drawn about optimal overlay sampling requirements and opportunities for high order correctable control (also referred to as HO or HOC).
Starting Page	359
Ending Page	365
File Size	1109466
Page Count	7
File Format	PDF
ISBN	9781424419647
ISSN	10788743
DOI	10.1109/ASMC.2008.4529071
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lithography Sampling methods Metrology Semiconductor device modeling Virtual manufacturing Semiconductor device manufacture Microscopy Control systems Web page design Data mining process control overlay metrology immersion mix and match sample plan
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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Overlay Control Requirements for Immersion Lithography

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