NDLI: Characterization and Optimization of Single Wafer Processing Equipment with Advanced Aqueous Formulations to Achieve Lower Cost of Ownership for Advanced Cu Interconnect Cleaning Processes

Content Provider	IEEE Xplore Digital Library
Author	Kirk, S. Chiu Tse Wang, E. Wu, C. Sang Min Wong Henry, S.A. Archer, L. West, J. Cakmak, E.
Copyright Year	2008
Description	Author affiliation: DuPont/EKC Technol., DuPont Electron. Technol., Phoenix, AZ (Kirk, S.; Chiu Tse; Wang, E.; Wu, C.; Sang Min Wong)
Abstract	The drive to minimize the RC delay in logic $copper/low-_{K}$ interconnect requires new material strategies, especially for porous $low-_{K}$ films for 45 nm and beyond. Incumbent cleaning offerings leave a gap in unmet needs. This gap has been filled with the introduction of advanced aqueous cleaning formulations. These highly aqueous formulations meet customer technical-roadmap requirements while also providing environmental sustainability. Advanced aqueous chemistries demonstrate excellent film compatibility, particularly on porous $low-_{K}$ materials. From a process standpoint, they enable faster chemical dispense coverage on the wafer, readily penetrate very small, high aspect-ratio features, and require significantly shorter de-ionized water (DI) rinse times than more traditional, solvent-based mixtures. These cleaning attributes lead to process cycle-time reductions, higher wafer throughput, and contribute to a lower cost-of-ownership (CoO). This study focuses on characterizing the interaction of an advanced aqueous chemical in a single-wafer cleaning tool, and subsequently optimizing the single-wafer equipment setup to minimize chemical usage. Segmentation of where chemical loss occurs and proposed mechanisms for the chemical loss are discussed. The segmentation data are then translated into an optimized best-known method (BKM) for the equipment setup, which includes both equipment facilities settings and specific process recipe parameters. The optimized setup is then validated through a series of marathon wafer runs to calculate process performance and chemical usage. Marathon testing results yielded > 20% reduction in chemical loss while maintaining equal or better cleaning performance compared to the previous process-of-record (POR) for solvents. This emphasizes the importance of matching process and chemical to provide optimal performance and lower CoO.
Starting Page	228
Ending Page	232
File Size	289272
Page Count	5
File Format	PDF
ISBN	9781424419647
ISSN	10788743
DOI	10.1109/ASMC.2008.4529043
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-05-05
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Cost function Cleaning Chemical processes Copper Delay Logic Green products Chemistry Throughput Optimization methods
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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