NDLI: In situ particle monitors: a new process control technology for Digital Semiconductor's Fab 6

Content Provider	IEEE Xplore Digital Library
Author	Field, D.
Copyright Year	1997
Description	Author affiliation: Digital Equipment Corp., Hudson, MA, USA (Field, D.)
Abstract	As part of the start-up strategy for Digital Semiconductor's Fab 6 facility, a project was implemented to use a new technology for monitoring particle levels in vacuum process tools. The current practice of running witness wafers to gauge surface defects has several drawbacks, including wafers cost and reduction of process tool throughput. A development project team was put into place to install, analyze, and implement vacuum In Situ Particle Monitors (ISPM) into Digital Semiconductor's Fab 6 manufacturing process. ISPM process sensors provide particle count information from inside a process tool in a real-time manner. ISPM sensors use light scattering techniques to detect particle levels within the vacuum system of a semiconductor process tool. By monitoring particle levels continuously, the ISPMs can quickly signal out of specification process events and monitor routine operations without impacting tool availability. This paper discusses the application of ISPM sensors onto both etch and deposition process tools. Specifically, data for an oxide etch process tool is presented. The ISPM data has shown correlation to tool conditions and been used to identify various process problems. Reduction of process monitor wafers has been achieved for the oxide etch process and is fully implemented in manufacturing. A crude ROI estimate shows a payback period of approximately 50 weeks. In all, the ISPM program in Fab 6 has demonstrated good results and is targeting other process applications.
Starting Page	294
Ending Page	299
File Size	417582
Page Count	6
File Format	PDF
ISBN	0780340507
ISSN	10788743
DOI	10.1109/ASMC.1997.630751
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-09-10
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Process control Etching Monitoring Vacuum technology Manufacturing processes Costs Throughput Sensor systems Light scattering Vacuum systems
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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