NDLI: Evaluation of defect detection schemes for CMP process monitoring using rigorous 3-D EM simulations

Content Provider	IEEE Xplore Digital Library
Author	Swecker, A.L. Strojwas, A.J. Levy, A. Bell, B.
Copyright Year	1997
Description	Author affiliation: Dept. of Electr. & Comput. Eng., Carnegie Mellon Univ., Pittsburgh, PA, USA (Swecker, A.L.)
Abstract	In this paper, various defect detection schemes are investigated for the post chemical mechanical polishing (CMP) inspection application using the simulation tool, METRO. Both bright field and dark field detection schemes have been studied to determine the methods of reducing the impact of layer thickness variation. Two critical CMP process defects, microscratches and particles, are evaluated. Using METRO, high resolution bright field is shown to have superior sensitivity to lower resolution bright field. Several illumination bandwidths and optical resolutions are studied in the presence of CMP color noise or oxide thickness variation. Ultra broad band (UBB) bright field detection is shown to have reduced color noise compared to traditional bright field detection. For dark field detection at a grazing angle of illumination, circular polarization is shown to have a scattering cross-sectional intensity that will provide better detection of the defects. Tungsten adhesion deposition, used after oxide CMP and contact patterning, is presented as an excellent zone monitor inspection point while significantly reducing the impact of layer thickness variation and underlying pattern noise. At this step, dark field simulations at multiple illumination angles illustrates that using a grazing angle of illumination, slurry particles will be detected exponentially better than at a higher angle.
Starting Page	283
Ending Page	288
File Size	800173
Page Count	6
File Format	PDF
ISBN	0780340507
ISSN	10788743
DOI	10.1109/ASMC.1997.630749
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1997-09-10
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Monitoring Lighting Inspection Optical scattering Colored noise Chemicals Bandwidth Optical noise Optical sensors Optical polarization
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electronic, Optical and Magnetic Materials Electrical and Electronic Engineering

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3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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